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Home > products > Aviation Parts > Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Product Details

Place of Origin: USA

Brand Name: Xilinx

Model Number: XQV300-4BG352N

Payment & Shipping Terms

Minimum Order Quantity: 1 pcs

Price: Negotiable

Packaging Details: boxes

Delivery Time: 12-14weeks

Payment Terms: L/C, T/T

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Highlight:
Package:
PLASTIC, BGA-352
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay Of A CLB-Max:
0.8 Ns
JESD-30 Code:
S-PBGA-B352
Operating Temperature-Min:
-55.0 Cel
Supply Voltage-Nom:
2.5 V
Supply Voltage-Max:
2.625 V
Technology:
CMOS
Terminal Finish:
Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s):
30
Package:
PLASTIC, BGA-352
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay Of A CLB-Max:
0.8 Ns
JESD-30 Code:
S-PBGA-B352
Operating Temperature-Min:
-55.0 Cel
Supply Voltage-Nom:
2.5 V
Supply Voltage-Max:
2.625 V
Technology:
CMOS
Terminal Finish:
Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s):
30
Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

 

 

Descriptions of Aviation Parts :

 

The QProTM VirtexTM FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 0.22 µm CMOS process. These advances make QPro Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays. The Virtex family comprises the four members shown in Table 1. Building on experience gained from previous generations of FPGAs, the Virtex family represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the QPro Virtex family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market. Refer to the "VirtexTM 2.5V Field Programmable Gate Arrays" commercial data sheet for more information on device architecture and timing specifications.

 

Features of Aviation Parts:

 

Certified to MIL-PRF-38535 (Qualified Manufacturer Listing) Guaranteed over the full military temperature range to +125°C) Ceramic and Plastic Packages Fast, high-density Field-Programmable Gate Arrays Densities from to 1M system gates System performance to 200 MHz Hot-swappable for Compact PCI 16 high-performance interface standards Connects directly to ZBTRAM devices Four dedicated delay-locked loops (DLLs) for advanced clock control Four primary low-skew global clock distribution nets, plus 24 secondary global nets LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register Configurable synchronous dual-ported 4K-bit RAMs Fast interfaces to external high-performance RAMs Dedicated carry logic for high-speed arithmetic Dedicated multiplier support Cascade chain for wide-input functions Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset Internal 3-state bussing IEEE 1149.1 boundary-scan logic Die-temperature sensing device

 
 

 

Specification of Aviation Parts :

 

Mfr Package Description

PLASTIC, BGA-352

REACH Compliant Yes
Status Discontinued
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max 0.8 ns
JESD-30 Code S-PBGA-B352
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of CLBs 1536.0
Number of Equivalent Gates 322970.0
Number of Inputs 260.0
Number of Logic Cells 6912.0
Number of Outputs 260.0
Number of Terminals 352
Operating Temperature-Min -55.0 Cel
Operating Temperature-Max 125.0 Cel
Organization 1536 CLBS, 322970 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225
Power Supplies 1.2/3.6,2.5
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 1.7 mm
Sub Category Field Programmable Gate Arrays
Supply Voltage-Nom 2.5 V
Supply Voltage-Min 2.375 V
Supply Voltage-Max 2.625 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Length 35.0 mm
Width 35.0 mm

 

Aviation Parts XQV300-4BG352N  Xilinx FPGA Package PLASTIC, BGA-352 0